Description
Powerful Apollo Lake Processor
- N4200 (2M Cache, up to 2.5 Ghz, TDP 6W)
- N3350 (2M Cache, up to 2.4 Ghz, TDP 6W)
1.48X Performance Improvement
(CPU Passmark)
Power Consumption Reduction
Lower Power Consumption Fanless Thermal
Design for Less Environmental Impact
Support 3 Ports LAN and 2 w/ PoE+ options
- Total supports 3 x Giga LAN
- 2 x LAN supports 802.3af and 802.3at PoE
Versatile Xpansion Modules
- Support HDMI + VGA, DVI, or DisplayPort
- Support power COM port &Digital I/O for iIoT application
MS-01VGA-D10
VGA Port Expansion Module
MS-01DVI-D10
DVI-D Port Expansion Module
MS-01DPN-D10
DisplayPort Expansion Module
MS-02COM-D10
Expansion Module with 2 x RS232 / 422 / 485 (support power 5V/12V)
MS-08DIO-T10
Expansion Module with 8-bit Isolated DIDO (4 x DI, 4 x DO)
Edge AI Accelerator
Intel® Movidius™ Myriad™ X for Edge AI
MB1-10AP with AI modules powered by Intel® Movidius™ Myriad™ X creates the possibility to be implemented in more Edge AI solutions, for example, traffic flow monitoring and real-time decision, manufacturing yield rate improvement via AI algorithm, remote healthcare service, and efficient transportation.
Integrated thermal solution for total fanless desig
Low Power Consumption Design
Support Intel OpenVINO Toolkit
Supported Framework:
TensorFlow, Caffe, MXNET
Support Flexible Configuration For Dual Display
- Support HDMI as primary display
- Support secondary display (DisplayPort, DVI-D, or VGA) with Xpansion module options
- Increase the flexibility to aim at target markets
Advanced Power Protection
Wide Power Range
8V~24V
Power Protection
- Reverse Power Input Protection
- Over Voltage Protection: 30V
- Over Current Protection: 16.6A
- ESD Protection: +/-15kV (air), +/-8kV (contact)
- Surge Protection: 3kW
-25~70oC Wide Temperature
MB1-10AP is designed in patented aluminum enclosure not only for aesthetic appearance but also for fan-less application in extreme temperature condition from -25℃ to 70℃.
Extreme Shock & Vibration Resistance
Shock Resistance
Operating, 50 Grms, Half-sine 11 ms Duration(w/ SSD, according to IEC60068-2-27)
Vibration Resistance
Operating, 5 Grms, 5-500 Hz, 3 Axes(w/ SSD, according to IEC60068-2-64)
Clear Installation Design
| MB1-10AP (MB1-10AP) Specifications | |||
|---|---|---|---|
| SYSTEM | CPU | Intel® Apollo Lake-M N4200 / N3350 Processor | |
| CHIPSET | Intel® SoC Integrated | ||
| SYSTEM MEMORY | DDR3L 1866 MHz / 1 x 204-pin SO-DIMM / Max. 8GB (Non-ECC) | ||
| GRAPHICS | Intel® HD Graphics | ||
| DISPLAY INTERFACE | HDMI 1.4 / Optional DisplayPort/VGA/DVI-D by Expansion Module | ||
| STORAGE SLOT | 1 x 2.5 HDD / SSD (Default w/ HDD Bracket) / 1 x mSATA | ||
| ETHERNET | 2 x Intel® I210-IT Giga LAN (Optional 2 x Output PoE LAN support 802.3af and 802.3at. Maximum Power Budget 30W for dual port) / 1 x Realtek RTL8154 LAN (Up to 480Mbps) | ||
| AUDIO | Realtek® ALC662 / ALC888 | ||
| I/O CHIPSET | Nuvoton NCT6116D | ||
| TPM | Nuvoton NPCT750AAAYX TPM2.0 (Optional) | ||
| EXPANSION SLOT | LTE/Wireless: Mini PCIe Full size (USB / PCIe), w/ SIM Card Holder (w/ Full to Half size adapter plate) / Storage: mPCIe Full size (USB / PCIe / SATA) | ||
| INTERNAL SPEAKER | 1 x Buzzer | ||
| INDICATOR | Power Button / Power LED / HDD LED | ||
| FRONT I/O | 1 x HDMI 1.4 / 4 x USB 3.0 / 2 x SMA Antenna (Optional for WiFi/LTE function) / 1 x Xpansion Module Door / 2 x RS232 / 422 / 485 (Support Power 5V / 12V) | ||
| REAR I/O | 1 x 2-pin Header Remote Power on / off / 3 x RJ-45 / 1 x Mic-in / 1 x Line-out / 1 x 3-pin Terminal Block Power Input / 2 x SMA Antenna (Optional for WiFi/LTE function) | ||
| WATCHDOG TIMER | 1~255 steps by software program | ||
| EDGE AI ENGINE (Optional) | Single Movidius Myriad X VPU, and Intel® OpenVINO™ toolkit supported (Optional) | ||
| POWER REQUIREMENT | POWER INPUT | 8~24V Wide Range DC Input w/ Terminal Block Connectivity | |
| POWER ADAPTER | Optional | ||
| ENVIRONMENTAL | OPERATING TEMPERATURE | -25°C to 70°C (For non-PoE SKU) / -25°C to 60°C (For PoE SKU) / with 0.7m/s Air Flow and Wide Temperature Memory/Storage | |
| STORAGE TEMPERATURE | -40 ~ 85°C (-40 ~185°F) | ||
| OPERATING HUMIDITY | 10% ~ 90% R/H (Non-condensing) | ||
| STORAGE HUMIDITY | 10% ~ 95% @85°C non-condensing | ||
| VIBRATION RESISTANCE | Operating: 5Hz~500Hz / 5Grms / 3Axis (w/ SSD, according to IEC60068-2-64) | ||
| SHOCK RESISTANCE | Operating: 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27) | ||
| CERTIFICATION | CE / FCC Class A | ||
| MECHANICAL | THERMAL DESIGN | Fanless | |
| MOUNTING | Wallmount / 75 mm x 75 mm VESA Holes & Din Rail Mount Combo Kit (Optional) | ||
| DIMENSIONS (W X D X H) | 6.9” x 4.1” x 2.2” (170 x 105 x 57 mm) | ||
| WEIGHT | 1.3kg (2.8 lb) | ||
| MATERIAL | Top cover: Aluminum Alloy / Bezel and chassis: Steel | ||
| OS | OS SUPPORT | Windows® 10 64-bit / Linux (support by request) | |
| PACKING LIST | PACKAGE | 1 x Quick Installation Guide / 1 x Embedded System / 1 x Wall Mount Brackets / 1 x 3 pin Terminal Block Power Connector / 1 x Full to Half Size mPCIe Card Adapter Plate | |